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OmniScan X4 Series

OmniScan X4 Series

Using the powerful yet portable OmniScan™ X4 multitechnology defect detector, complex defects can be detected and interpreted, as well as early identification of alterations. Take advantage of its features such as versatile PA, faster TFM, innovative PCI, and efficient TFM/PCI combination to perform weld and component inspections, quickly and reliably.

01
Dimensions (Width × Height × Depth)
335 mm × 221 mm × 151 mm
02
Weight
5.7 kg (with 1 battery) for 16:64PR model – 5.9 kg (with 1 battery) for 16:128PR, 32:128PR and 64:128PR models
03
Internal memory
1 TB SSD internal storage. Maximum single file size of 25 GB. Expandable memory via external USB key
04
Storage media
SDH and SDXC cards or standard USB storage media
05
Wireless
Wi-Fi® 6E and Bluetooth® 5.3 integrated
06
Display
269 ​​mm (10.6") TFT LCD with resistive touch screen, 1280 × 768 pixels
07
Batteries
2 hot-swappable lithium-ion batteries included, 87 Wh each
08
Battery life
Maximum 5 hours (applying the configuration parameters required by ISO 18563)
09
Operating temperature
−10 °C to 45 °C

Why choose OmniScan X4 Series?

01

Overview

A portable yet powerful solution, the speed and versatility of the OmniScan™ X4 multi-technology series increase your productivity and the reliability of your assessments. It leverages its advanced phased array capabilities, efficient total focusing method (TFM), and innovative phase coherence imaging (PCI) to detect and interpret problematic defects and ensure infrastructure integrity by identifying damage early.

02

Performance and reliability

Each OmniScan X4 unit is a complete multi-technology inspection kit, allowing you to leverage multiple ultrasonic inspection techniques. It leverages its sensing and measurement capabilities to accurately identify and assess the severity of damage before it becomes critical, protecting welds, components and infrastructure most prone to cracking or corrosion.

03

Certain evaluations with the PCI

Eliminate doubt with phase coherence imaging's ability to detect and accentuate typically difficult-to-detect defects, such as hook cracks and stress corrosion cracking (SCC). Use PCI to clearly distinguish individual defects in fine crack colonies and characterize them with certainty.

04

3x faster TFM acquisition rate

Get sharp TFM images at up to three times the acquisition rate* compared to the previous model (X3 64) thanks to the improved processing power of the OmniScan X4 series. Take advantage of the increased speed and 128-element capacity of the OmniScan X4 64:128PR to perform TFM inspections with extended focus capability.

05

Eliminate inefficiency

Double the reliability with Twin TFM and PCI Leverages the individual attributes of PCI and TFM to accurately analyze solder volume from both sides simultaneously. It uses two probes to scan the weld in a single pass, viewing TFM and PCI results to compare, measure and confirm indication characterization with efficiency and precision.

01

Overview

A portable yet powerful solution, the speed and versatility of the OmniScan™ X4 multi-technology series increase your productivity and the reliability of your assessments. It leverages its advanced phased array capabilities, efficient total focusing method (TFM), and innovative phase coherence imaging (PCI) to detect and interpret problematic defects and ensure infrastructure integrity by identifying damage early.

02

Performance and reliability

Each OmniScan X4 unit is a complete multi-technology inspection kit, allowing you to leverage multiple ultrasonic inspection techniques. It leverages its sensing and measurement capabilities to accurately identify and assess the severity of damage before it becomes critical, protecting welds, components and infrastructure most prone to cracking or corrosion.

03

Certain evaluations with the PCI

Eliminate doubt with phase coherence imaging's ability to detect and accentuate typically difficult-to-detect defects, such as hook cracks and stress corrosion cracking (SCC). Use PCI to clearly distinguish individual defects in fine crack colonies and characterize them with certainty.

04

3x faster TFM acquisition rate

Get sharp TFM images at up to three times the acquisition rate* compared to the previous model (X3 64) thanks to the improved processing power of the OmniScan X4 series. Take advantage of the increased speed and 128-element capacity of the OmniScan X4 64:128PR to perform TFM inspections with extended focus capability.

05

Eliminate inefficiency

Double the reliability with Twin TFM and PCI Leverages the individual attributes of PCI and TFM to accurately analyze solder volume from both sides simultaneously. It uses two probes to scan the weld in a single pass, viewing TFM and PCI results to compare, measure and confirm indication characterization with efficiency and precision.